Explore IMEC's latest semiconductor roadmap, revealing the future of process node technology through 2039, including advancements in transistor design like FinFETs, nanosheets, and the revolutionary complimentary FETs (CFETs). Discover the cutting-edge lithography machines, from current EUV to future High-NA EUV and even "hyper NA EUV," essential for enabling these smaller, more powerful chips. We'll also delve into the complex challenges of power delivery and the integration of exotic 2D materials, offering a rare glimpse into the monumental engineering feats required for tomorrow's silicon.
[
00:00] Introduction to Process Node Technology
[
00:26] Introduction to IMEC and their Role
[
01:18] IMEC's Updated Roadmap to 2039
[
02:23] Nanometer Naming Convention is Not a Physical Dimension
[
05:22] FinFETs and the Move to Nanosheets (Gate-All-Around)
[
06:10] Main Lithography Machine Technology (EUV)
[
07:11] High-NA EUV as the Next Generation of Lithography
[
08:40] Backside Power Delivery Innovation
[
09:38] Nanosheet Era (N2 to A10) and Fork Sheet Transistors
[
10:50] Complimentary FETs (CFETs) and Double Density
[
13:53] 2D Materials (Millennium Disulfide, Tungsten DiTelluride)
[
19:12] Scaling Research into Fab Production
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Ending music:
https://www.youtube.com/watch?v=2N0tmgau5E4
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